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Biocompatibility Evaluation of Hollow Pollen Grains/Fe3 O4 Nanoparticles Composites as Potential Medical Devices

Research output: Contribution to journalArticlepeer-review

Abstract

Recently, pollen grains (PGs) have been introduced as drug carriers and scaffolding building blocks. This study aimed to assess the in-vitro biocompatibility of Pistacia vera L. hollow PGs/Fe3O4 nanoparticles (HPGs/Fe3O4NPs) composites using human adipose-derived mesenchymal stem cells (hAD-MSCs). In this regard, iron oxide nanoparticles (Fe3O4NPs) were assembled on the surface of HPGs at different concentrations. The biocompatibility of the prepared composites was assessed through MTT assay, apoptosis-related gene expression and field emission scanning electron microscopy (FE-SEM) analysis. Compared to the bare HPGs, the HPGs/Fe3O4NPs exhibited a biphasic impact on hAD-MSCs. The composite containing 1% Fe3O4NPs demonstrated no cytotoxicity up to 21 days while higher Fe3O4NPs contents and long-term exposure revealed adverse effects on the hAD-MSCs' growth. The obtained result was verified by the qRT-PCR and morphological analysis carried out through FE-SEM which suggests that a narrow region below 1% Fe3O4NPs may be the optimum choice for medicinal applications of HPGs/Fe3O4NPs microdevices.
Original languageEnglish
Article number2150048
JournalInternational Journal of Nanoscience
Volume20
Issue number5
DOIs
StatePublished - Oct 1 2021

Bibliographical note

Publisher Copyright:
© 2021 World Scientific Publishing Company.

ASJC Scopus Subject Areas

  • Biotechnology
  • Bioengineering
  • General Materials Science
  • Condensed Matter Physics
  • Computer Science Applications
  • Electrical and Electronic Engineering

Keywords

  • biocompatibility
  • Fe4 nanoparticles
  • human adipose-derived mesenchymal stem cells
  • Pistacia vera L
  • Pollen grain

Disciplines

  • Biotechnology
  • Other Biomedical Engineering and Bioengineering
  • Materials Science and Engineering
  • Condensed Matter Physics
  • Computer Sciences
  • Electrical and Computer Engineering

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