Abstract
Copper alloy containing up to 18 percent tin was deposited in ammoniacal electroless plating solutions containing dimethylamine borane and ethylenediamine tetraacetic acid. Alloy with a tin content of 10 percent was deposited at the rate of 1 μm/hr. The effects of changing the temperature and the concentration of each bath constituent are detailed in this paper.
| Original language | English |
|---|---|
| Pages | 54-57 |
| Number of pages | 4 |
| Volume | 76 |
| No | 9 |
| Specialist publication | Plating and Surface Finishing |
| State | Published - Sep 1989 |
| Externally published | Yes |
ASJC Scopus Subject Areas
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Materials Chemistry
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